Manho Lee, Jun So Pak, Joungho Kim (eds.) Electrical Design of Through Silicon Via

Springer, 2014. — 286 р.Provides fundamental modeling of TSV which is a very essential part of 3D ICs. Includes both numerical formula analysis and qualitative explanations. Approach from various view points: signal integrity, power integrity and etc. Has appeal for academia and industry.
Includes supplementary material: sn.pub/extras