Johnson R.W., Teng R.K.F., Balde J.W. (Eds.) Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies

IEEE Press, 1991. — 598 p. — (IEEE Press Selected Reprint Series). — ISBN: 0-87942-267-X.Multichip packaging technology has received widespread attention in the electronics industry. The use of multichip modules promises to increase circuit density and increase circuit performance beyond that otherwise possi­ble through the use of VLSI and surface mount technology. Because this technology is so new and growing so fast, there is no comprehensive book on the subject. Chapters of hand­ books and textbooks presently available cover only selected aspects of the technology.
As with any such fast-moving technology, the best way to capture the available information is to publish a selection of seminal papers. Some of the information was first published years ago, but much is in very recent conference proceed­ ings. In very few cases have the papers reached the archival technical publications. A selection of these conference papers provides the best available information today. The original idea for this book came from some discussions during the 38th ECC in Los Angeles, 1988.
This book should be the primary source of information for engineers working in this area, students and professors in the packag­ing-related courses at colleges and universities, and perhaps even for the managers who need to make the hard technical choices about the technology for their new systems.
OCR 300 dpi.