CRC Press 2010. — 416 p. — ISBN13: 978-1-4398-5076-3.
A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors.
About the Autho.r
Chapter 1 Introduction.
Thermodynamics of airflow.
Airflow I: Forced flow in systems.
Airflow II: Forced flow in ducts, extrusions, and pin fin arrays.
Airflow III: Buoyancy driven draft.
Forced convective heat transfer I: Components.
Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays.
Natural convection heat transfer I: Plates.
Natural convection heat transfer II: Heat sinks.
Thermal radiation heat transfer.
Conduction I: Basics.
Conduction II: Spreading resistance.
Additional mathematical methods.
Appendix.