Alexe M., Gösele U. Wafer Bonding: Applications and Technology

Springer, 2004. — 510 p. — ISBN: 978-3-642-05915-5.Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
Basics of Silicon-on-Insulator (SOI) Technology
Silicon-on-insulator by the Smart Cut Process
ELTRAN Technology Based on Wafer Bonding and Porous Silicon
Wafer Bonding for High-Performance Logic Applications
Application of Bonded Wafers to the Fabrication of Electronic Devices
Compound Semiconductor Heterostructures by Smart Cut: SiC On Insulator, QUASIC Substrates, InP and GaAs Heterostructures on Silicon
Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits
Layer Transfer by Bonding and Laser Lift-Off
Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
Wafer Bonding of Ferroelectric Materials
Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications