Li Suny. SiP System-in-Package Design and Simulation

Wiley, 2017. — 486 p. — ISBN10: 1119045932, ISBN13: 978-1119045939.Preview ebook
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow
Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.
Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:
Cavity and sacked dies design
FlipChip and RDL design
Routing and coppering
3D Real-Time DRC check
SiP simulation technology
Mentor SiP Design and Simulation Platform
Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.About the AuthorSiP Design and Simulation Platform
Introduction to Package
The SiP Production Process
New Package Technologies
SiP Design and Simulation Flow
Central Library
Schematic Input
Multi-board Project Management and Concurrent Schematic Design
Layout Creation and Setting
Constraint Rules Management
Wire Bond Design
Flip Chip and RDL Design
Route and Plane
Embedded Passives Design
RF Circuit Design
Concurrent Layout Design
3D Real-time DRC
Design Review
Manufacturing Data Output
SiP Simulation Technology
Reference Materials.
Postscript and Thanks