Sicard E., Bendhia S.D. Advanced CMOS Cell Design

McGraw-Hill Professional, 2007. — 364 p.Abbreviations and Symbols.
Technology Scale-down.
Recent Trends in CMOS Technology.
Introducing the 90 nm Technology.
Embedded Memories.
The World of Memory.
RAM Memory.
RAM Array.
Dynamic RAM Memory.
EEPROM.
Flash Memories.
Ferroelectric RAM Memories.
Memory Interface.
A Very-Simple-Microprocessor.Instructions.
Program Memory.
Executing Instructions.
Basic Block Design.Field-Programmable Gate Array.Confi gurable Logic Circuits.
Programmable Logic Block.
Interconnection Between Blocks.Radio-Frequency Circuits.
Target Radio-Frequencies.
Inductor.
Power Amplifier.
Oscillators.
Phase-Lock Loop.
Frequency Converter.
Sub-sampling Frequency Converter.Converters and Sensors.Digital-Analog Converter Architectures.
Sample and Hold Circuits.
Analog-Digital Converter Architectures.
Temperature Sensor.
Image Sensors.Input/Output Interfacing.
Power Supply.
The Bonding Pad.
The Pad Ring.
Input Structures.
Digital Output Structures.
Pull-up, Pull-down.
Low Voltage Differential Swing.
Power Clamp.
Core/Pad Limitation.
I/O Pad Description Using IBIS.
Connecting to the Package.
Signal Propagation Between Integrated Circuits.Silicon on Insulator.SOI Technology Issues.
SOI Device Model.
SOI Design.
The Tera-Hertz MOS Device.Future and Conclusion.
Predicting the Unpredictable.Appendices.
Design Rules.
Lambda Units.
Layout Design Rules.
Pads.
Electrical Extraction Principles.
Node Capacitance Extraction.
Resistance Extraction.
Simulation Parameters.
Technology Files for DSCH.
MICROWIND31 Program Operation and Commands.
Getting Started.
List of Commands in MICROWIND31.
DSCH31 Logic Editor Operation and Commands.
Getting Started.
Commands.
Quick Reference Sheet.
MICROWIND31 Menus.
MICROWIND3.1 Simulation Menu.
DSCH3.1 Menu.
Silicon Tool.
List of Files.
File Organization.
Interface to WinSpice.
About WinSpice3.
SPICE Syntax.
Generate a SPICE File with DSCH3.1.
Generate a SPICE File with MICROWIND3.1.