Brown R. RF/Microwave Hybrids: Basics, Materials and Processes

New York: Kluwer Academic Publishers, 2004. — 283 p. — ISBN: 1441953132, 9781441953131.The text begins with an introduction to hybrid technology and basic high frequency principles. Following these, the major forms of transmission waveguide are discussed, and then current flow and loss considerations. Substrates, thick and thin film deposition, polymers, artwork, masks, photolithography, subtractive, additive and semi-additive methods, electro- and electroless plating and etching are covered. Passive and transmission line components are then treated within the confines of process requirements. With this background established, the text is directed toward the effects of processing and materials on passive and transmission line-based components. Packaging is discussed with emphasis on inductance considerations.Preface.
Acknowledgements.

Hybrids vs MMICs.

Basic Concepts.Maxwell's Laws.
Permittivity and Permeability.
Free Space Wavelength.
Propagation velocity.
Decibel Scale (dB).
Q Measurements.
Small Signal (S-Parameters).Planar Waveguides.
Impedance.
Microstrip.
Guide Wavelength (λ_g).
Coplanar.
Stripline.Current Flow and Loss Considerations.
Dielectric losses.
Conductor losses.Substrates.
Glass.
Single crystals.
Polycrystalline ceramics.
Low temperature cofired (LTCC).
Clad Materials.
Cleaning.
Safety.Thick Film.
Screen printing.
Metal foil screens.
Lithographically defined thick film.
Additive techniques.Thin Film.
Physical vapor deposition.Dielectric Deposition.
PELPCVD.
Anodization.Polymers.
Material Properties.
Deposition.
Patterning.
Photosensitive polymers.Processing Strategies.Photolithography.
Photoresist.
Artwork and masks.
Exposure.Electroplating.
General.
Inorganic additives.
Organic additives.
Waveforms.
Field density.
Electroless.Etching.
Wet etching.
Dry etching.
Etching effects on imedance.Components.
Passive components.
Transmission line components.Packaging.
Level oflntegration.
Interconnects.Superconductivity.
Properties of High-Tc materials.
Materials considerations.
Substrate materials.
Expansion coefficient.
Buffer (barrier) layers.
Film formation.
Patterning.MEMS.Appendixes.